Summary Conclusions for Successful Usage of ASTM C 1736
Bond-line stress using the methodology of ASTM C 1736 is concentrated at the uppermost corner of the sealant where it intersects the substrate in a manner similar to a peel test, without impacting the underlying bond-line. Therefore,
when the force delivered to the elastic sealant is controlled, the following will hold:
• The test probe wheel width does not affect the total stress delivered to the bond-line.
• Geometry, as an aspect ratio of the bead, does not affect the bond-line stress unless the bead thickens significantly relative to the calibrated measure.
A reasonable non-destructive force load producing “appropriate bond-line stress" must be within the limits of the joint design in conjunction with the movement capability of the sealant.